X-ray TDI camera: C12300-321

• High speed readout
• Horizontal chassis
• Bidirectional scanning operation

Evolutional high speed scanning with TDI technology. Bidirectional scanning operation is supported.

• Effective X-ray tube voltage range
  Approx. 25 kV to 130 kV
• Detection width
  221.1 mm
• Effective no. of pixels
  4608 (H)
• Line speed
  Max. 86.4 m/min
  (Binning 2×2)

Photodiode array with amplifier: S11865-128G

Integrating photodiode array and signal processing circuit into a same package

• Number of effective pixels
  128 pixels
• Pixel size
  0.3 x 0.6 mm
• Note
  for X-ray
• Line speed
  Max. 86.4 m/min
  (Binning 2×2)

Photodiode array with amplifier: S11865-256G

Integrating photodiode array and signal processing circuit into a same package

• Number of effective pixels
  256 pixels
• Pixel size
  0.1 x 0.3 mm
• Note
  for X-ray
• Line speed
  Max. 86.4 m/min
  (Binning 2×2)

Photodiode array with amplifier: S11865-64G

Integrating photodiode array and signal processing circuit into a same package

• Number of effective pixels
  64 pixels
• Pixel size
  0.7 x 0.8 mm
• Note
  for X-ray
• Line speed
  Max. 86.4 m/min
  (Binning 2×2)

Photodiode array with amplifier: S11866-128G-02

Integrating photodiode array and signal processing circuit into a same package

• Number of effective pixels
  128 pixels
• Pixel size
  0.7 x 0.8 mm
• Note
  for X-ray
• Line speed
  Max. 86.4 m/min
  (Binning 2×2)

Photodiode array with amplifier: S11866-64G-02

Integrating photodiode array and signal processing circuit into a same package

• Number of effective pixels
  64 pixels
• Pixel size
  1.5 x 1.6 mm
• Note
  for X-ray
• Line speed
  Max. 86.4 m/min
  (Binning 2×2)

Flat panel sensor: C7942CA-22

120 x 120 mm sensitive area with aluminium window

• Photosensitive area
  120 x 120 mm
• Pixel size
  50 x 50 μm
• Number of total pixels
  2400 x 2400 pixels
• Line speed
  Max. 86.4 m/min
  (Binning 2×2)

X-ray TDI camera: C10650-221

• Horizontal chassis

X-ray TDI camera is useful for in-line applications requiring high-speed operation with high sensitivity. (Standard type)

• Effective X-ray tube voltage range
  Approx. 25 kV to 90 kV
• Detection width
  145.9 mm
• Effective no. of pixels
  3040 (H)
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

X-ray TDI camera: C10650-261

• Horizontal chassis
• Overlap type

X-ray TDI camera is useful for in-line applications requiring high-speed operation with high sensitivity.

• Effective X-ray tube voltage range
  Approx. 25 kV to 90 kV
• Detection width
  146.9 mm
• Effective no. of pixels
  3072 (H)
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

X-ray TDI camera: C10650-261V

• Vertical chassis
• Overlap type

X-ray TDI camera is useful for in-line applications requiring high-speed operation with high sensitivity.

• Effective X-ray tube voltage range
  Approx. 25 kV to 90 kV
• Detection width
  146.9 mm
• Effective no. of pixels
  3072 (H)
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

X-ray TDI camera: C10650-261W

• Vertical chassis
• Overlap type
• 2 cameras output

X-ray TDI camera is useful for in-line applications requiring high-speed operation with high sensitivity.

• Effective X-ray tube voltage range
  Approx. 25 kV to 90 kV
• Detection width
  439.9 mm
• Effective no. of pixels
  9216 (H)
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

X-ray TDI camera: C10650-321

• Horizontal chassis

X-ray TDI camera is useful for in-line applications requiring high-speed operation with high sensitivity. (Standard type)

• Effective X-ray tube voltage range
  Approx. 25 kV to 90 kV
• Detection width
  221.1 mm
• Effective no. of pixels
  4608 (H)
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

X-ray TDI camera: C10650-361

• Horizontal chassis
• Overlap type

X-ray TDI camera is useful for in-line applications requiring high-speed operation with high sensitivity.

• Effective X-ray tube voltage range
  Approx. 25 kV to 90 kV
• Detection width
  220.2 mm
• Effective no. of pixels
  4608 (H)
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

X-ray TDI camera: C10650-361V

• Vertical chassis
• Overlap type

X-ray TDI camera is useful for in-line applications requiring high-speed operation with high sensitivity.

• Effective X-ray tube voltage range
  Approx. 25 kV to 90 kV
• Detection width
  220.2 mm
• Effective no. of pixels
  4608 (H)
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

X-ray TDI camera: C10650-361W

• Vertical chassis
• Overlap type
• 2 cameras output

X-ray TDI camera is useful for in-line applications requiring high-speed operation with high sensitivity.

• Effective X-ray tube voltage range
  Approx. 25 kV to 90 kV
• Detection width
  513.2 mm
• Effective no. of pixels
  10752 (H)
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

X-ray TDI camera: C10650-461

• Horizontal chassis
• Overlap type

X-ray TDI camera is useful for in-line applications requiring high-speed operation with high sensitivity.

• Effective X-ray tube voltage range
  Approx. 25 kV to 90 kV
• Detection width
  293.4 mm
• Effective no. of pixels
  6144 (H)
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

X-ray TDI camera: C10650-461V

• Vertical chassis
• Overlap type

X-ray TDI camera is useful for in-line applications requiring high-speed operation with high sensitivity.

• Effective X-ray tube voltage range
  Approx. 25 kV to 90 kV
• Detection width
  293.4 mm
• Effective no. of pixels
  6144 (H)
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

X-ray TDI camera: C10650-461W

• Vertical chassis
• Overlap type
• 2 cameras output

X-ray TDI camera is useful for in-line applications requiring high-speed operation with high sensitivity.

• Effective X-ray tube voltage range
  Approx. 25 kV to 90 kV
• Detection width
  586.4 mm
• Effective no. of pixels
  12288 (H)
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

FOS: J6671

• FOP with CsI Scintillator

• Outer Dimension
  30.5 x 21 mm
• Effective Area
  27 x 17 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

FOS: J6671-01

• FOP with CsI Scintillator

• Outer Dimension
  30.5 x 21 mm
• Effective Area
  27 x 17 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

FOS: J6673

• FOP with CsI Scintillator

• Outer Dimension
  50 x 10 mm
• Effective Area
  46 x 6 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

FOS: J6673-01

• FOP with CsI Scintillator

• Outer Dimension
  50 x 10 mm
• Effective Area
  46 x 6 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

FOS: J6675

• FOP with CsI Scintillator

• Outer Dimension
  18 x 18 mm
• Effective Area
  14 x 14 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

FOS: J6675-01

• FOP with CsI Scintillator

• Outer Dimension
  18 x 18 mm
• Effective Area
  14 x 14 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

FOS: J6677

• FOP with CsI Scintillator

• Outer Dimension
  50 x 50 mm
• Effective Area
  46 x 46 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

FOS: J6677-01

• FOP with CsI Scintillator

• Outer Dimension
  50 x 50 mm
• Effective Area
  46 x 46 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

FOS: J6679

• FOP with CsI Scintillator

• Outer Dimension
  Dia. 26.5 mm
• Effective Area
  Dia. 23.5 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

FOS: J6679-01

• FOP with CsI Scintillator

• Outer Dimension
  Dia. 26.5 mm
• Effective Area
  Dia. 23.5 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

Microfocus X-ray source: L9181-02

Tube voltage : 40 to 130 kV, Maximum output : 39 W, X-ray focal spot size : 5 um, Serial port control : RS-232C

• Outer Dimension
  Dia. 26.5 mm
• Effective Area
  Dia. 23.5 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

Microfocus X-ray source: L9181-05

Compared with ordinary L9181-02 (X-ray Beam Angle:45 degrees), L9181-05 has an wide X-ray Beam Angle of 100 degrees.

• Outer Dimension
  Dia. 26.5 mm
• Effective Area
  Dia. 23.5 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

Microfocus X-ray source: L9421-02

Tube voltage : 20 to 90 kV, Tube current : 0 to 200 uA, Maximum output : 8 W, X-ray focal spot size : 5 um, Serial port control : RS-232C

• Outer Dimension
  Dia. 26.5 mm
• Effective Area
  Dia. 23.5 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

Microfocus X-ray source: L9631

Tube voltage : 40 to 110 kV, Tube current : 10 to 800 uA, Maximum output : 50 W, X-ray focal spot size : 15 to 80 um, Serial port control : RS-232C

• Outer Dimension
  Dia. 26.5 mm
• Effective Area
  Dia. 23.5 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

Microfocus X-ray source: L10101

Tube voltage : 40 to 100 kV, Maximum output : 20 W, X-ray focal spot size : 5 um, Short FOD : 6.8 mm, Serial port control : RS-232C

• Outer Dimension
  Dia. 26.5 mm
• Effective Area
  Dia. 23.5 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

Microfocus x-ray source: L10321

Tube voltage : 40 to 100 kV, Maximum output : 20 W, X-ray focal spot size : 5 um, Short FOD : 7.3 mm, Serial port control : RS-232C

• Outer Dimension
  Dia. 26.5 mm
• Effective Area
  Dia. 23.5 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

Microfocus X-ray source: L10951

Tube voltage : 40 to 110 kV, Tube current : 10 to 800 uA, Maximum output : 50 W, X-ray focal spot size : 15 to 80 um, Serial port control : RS-232C

• Outer Dimension
  Dia. 26.5 mm
• Effective Area
  Dia. 23.5 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

Microfocus X-ray source: L12161-07

Tube voltage : 40 to 150 kV, Maximum output : 75 W, X-ray focal spot size : 5 um (at 4 W), Serial port control : RS-232C

• Outer Dimension
  Dia. 26.5 mm
• Effective Area
  Dia. 23.5 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

CCD area image sensor: S7199-01

Image sensor with a long, narrow photosensitive area for X-ray imaging (FOS type)

• Outer Dimension
  Dia. 26.5 mm
• Effective Area
  Dia. 23.5 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

CCD area image sensor: S7199-01F

Image sensor with a long, narrow photosensitive area for X-ray imaging (FOP type, without scintillator)

• Outer Dimension
  Dia. 26.5 mm
• Effective Area
  Dia. 23.5 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

CCD area image sensor: S8658-01

Image sensor with a long, narrow photosensitive area for X-ray imaging (FOP type)

• Outer Dimension
  Dia. 26.5 mm
• Effective Area
  Dia. 23.5 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

CCD area image sensor: S8658-01F

Imagesensor with a long, narrow photosensitive area (FOP type, without scintillator)

• Outer Dimension
  Dia. 26.5 mm
• Effective Area
  Dia. 23.5 mm
• CsI Thickness
  150 μm
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

16-element Si photodiode array: S11212-021

Back-illuminated photodiode arrays for X-ray non-destructive inspection

• Number of elements
  16
• Element size (per 1 element)
  1.175 × 2.0 mm
• Scintillator type
  None
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

16-element Si photodiode array: S11212-121

Back-illuminated photodiode array for X-ray non-destructive inspection, with CsI(Tl) scintillator

• Number of elements
  16
• Element size (per 1 element)
  1.175 × 2.0 mm
• Scintillator type
  CsI(Tl)
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

16-element Si photodiode array: S11212-321

Back-illuminated photodiode array for X-ray non-destructive inspection, with GOS ceramic scintillator

• Number of elements
  16
• Element size (per 1 element)
  1.175 × 2.0 mm
• Scintillator type
  GOS ceramic
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

16-element Si photodiode array: S11299-021

Back-illuminated photodiode array for X-ray non-destructive inspection

• Number of elements
  16
• Element size (per 1 element)
  1.175 × 2.0 mm
• Scintillator type
  None
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

16-element Si photodiode array: S11299-121

Back-illuminated photodiode array for X-ray non-destructive inspection, with CsI(Tl) scintillator

• Number of elements
  16
• Element size (per 1 element)
  1.175 × 2.0 mm
• Scintillator type
  CsI(Tl)
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

16-element Si photodiode array: S11299-321

Back-illuminated photodiode array for X-ray non-destructive inspection, with GOS ceramic scintillator

• Number of elements
  16
• Element size (per 1 element)
  1.175 × 2.0 mm
• Scintillator type
  GOS ceramic
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

Si photodiode: S12497

A scintillator can be mounted directly on the chip. photosensitive area: 9.5 x 9.5 mm

• Photosensitive area
  9.5 × 9.5 mm
• Spectral response range
  400 to 1100 nm
• Photosensitivity (typ.)
  0.57 A/W
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

Si photodiode: S12498

A scintillator can be mounted directly on the chip. photosensitive area: 6.0 x 6.0 mm

• Photosensitive area
  6.0 × 6.0 mm
• Spectral response range
  400 to 1100 nm
• Photosensitivity (typ.)
  0.57 A/W
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

16-element Si photodiode array: S12858-122

Back-illuminated photodiode array for X-ray non-destructive inspection (element pitch: 1.17 mm), with CsI(Tl) scintillator

• Number of elements
  16
• Element size (per 1 element)
  0.77 × 2.5 mm
• Scintillator type
  CsI(Tl)
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

16-element Si photodiode array: S12858-324

Back-illuminated photodiode array for X-ray non-destructive inspection (element pitch: 1.17 mm), with GOS ceramic scintillator

• Number of elements
  16
• Element size (per 1 element)
  0.77 × 2.5 mm
• Scintillator type
  GOS ceramic
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

16-element Si photodiode array: S12858-422

Back-illuminated photodiode array for X-ray non-destructive inspection (element pitch: 1.17 mm), with phosphor sheet

• Number of elements
  16
• Element size (per 1 element)
  0.77 × 2.5 mm
• Scintillator type
  Phosphor sheet
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

16-element Si photodiode array: S12859-122

Back-illuminated photodiode array for X-ray non-destructive inspection (element pitch: 1.17 mm), with CsI(Tl) scintillator

• Number of elements
  16
• Element size (per 1 element)
  0.77 × 2.5 mm
• Scintillator type
  CsI(Tl)
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

16-element Si photodiode array: S12859-324

Back-illuminated photodiode array for X-ray non-destructive inspection (element pitch: 1.17 mm), with GOS ceramic scintillator

• Number of elements
  16
• Element size (per 1 element)
  0.77 × 2.5 mm
• Scintillator type
  GOS ceramic
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)

16-element Si photodiode array: S12859-422

Back-illuminated photodiode array for X-ray non-destructive inspection (element pitch: 1.17 mm), with phosphor sheet

• Number of elements
  16
• Element size (per 1 element)
  0.77 × 2.5 mm
• Scintillator type
  Phosphor sheet
• Line speed
  Max. 10.702 m/min
  (Binning 2×2)